![]() ![]() Subsequent blog posts will talk about other aspects of teh reflow profile. ALPHA OM-350 is a lead-free, no-clean solder paste suitable for fine feature printing and reflow using most demanding soak reflow profiles in air and nitrogen atmospheres. A recommended ramp rate would be between 0.75☌/s and 2☌/s. Heating the paste too much before all the solvents evaporate will cause the viscosity to decrease which will then lead to solder slumping. Another defect you may see from a too fast ramp-up is slumping of the solder paste, which can lead to bridging. is formulated to offer best in class in circuit pin test yields, high electrical reliability, all in a zero halogen flux formulation. features a rheology capable of standard dispensing or high thru put jetting. It is crucial that this is a slow and controlled ramp-up if the paste is heated up too quickly the flux will boil and start to spatter solder all over the board. is a lead-free, no-clean solder paste designed for use in Jet Printers. The very beginning of the reflow process, during the first few oven zones, focuses on drying out the solvents in the solder paste, getting ready for the activators in the flux to begin removing oxides. For this reason it is important to understand the different stages of a reflow profile and how they can affect the end solder joint. Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. SiP & Heterogeneous Integration & Assembly (HIA).The Indium Corporation & Macartney Family Foundation.Warranties by the manufacturer are the sole responsibility of the provider. Seller shall not be liable for any injury, loss or damage, direct or inconsequential, arising out of the use of or inability to use the product. All returns MUST be accompanied by the RMA # an RMA # is valid for thirty days.Īll warranties are manufacturer warranties. TO RETURN A PRODUCT, CALL 88 or 31 between 8 am and 5 pm Pacific Time to get a Return Material Authorization (RMA) #. There may be a restocking fee if the item was a special order item. **Returns must be in manufacturer's original packaging, in saleable condition and with all manuals and accessories. **See "Warranty Policy" for problems covered under factory warranties. Key words: solder defects, reflow profile, tombstone, solder beads, solder balls, voids, head-in-pillow, graping. Shipping arrangements for returns must be made by the customer. Wide reflow profile window with good solderability on various board / component finishes. The original shipping and handling charges are not refundable unless your return is a result of our error. Refunds for items returned within thirty days of the purchase date will be credited in the same form as the original payment type. You must notify us within 30 days of shipment for any returns. If you are dissatisfied with your order for any reason, you can return your items for a prompt refund or exchange. ALPHA OM-340 SOLDER PASTE Technical Bulletin Issue: 19 October 2021 of 7 ALPHA OM-340 SOLDER PASTE No-Clean, Lead-Free, Fine Feature, Zero-Halogen, Low HiP, Highly Pin-Testable DESCRIPTION ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. If you discover any concealed (hidden) shipping damage or missing items after opening your shipment, please save the shipping box and call us so that we can file a claim with the freight package service in order to credit you or replace the item. Packages damaged in transit should be refused and not accepted contact us and we will re-ship your order. To request information about shipping to your country, contact us at: All international customs fees, duties, and taxes are the responsibility of the recipient.ĭiscrepancies in shipments should be reported within 3 days of receipt. thermal decomposition becomes more rapid as the temperature is. and North America are subject to special requirements and regulations. profile temperature range for high pitch solder paste reflow. Shipments to countries outside of the U.S. is a SnBiAg low temperature, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required. Water Soluble, Low Temperature Solder Paste. Items indicated as qualifying for Select free delivery status apply only to ship locations in the 50 United States. ALPHA WS-852 Technical Bulletin Issue: 16 March 2020 of 5. If only some items in your order are eligible for Select Free Shipping, you will pay applicable shipping charges for the ineligible items. Items eligible for Select Free Shipping will be designated as such on their product pages.
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